Package ListTITLEPackage List |
- DDR2
- DDR3
- DDR4
- LPDDR
- eMMC/MCP
- NAND
- LOGIC
Package Type | Package Size | Ball/Lead Pitch | Ball Size |
60B wBGA | 8x10x1.2(Max.) | 0.8mm | 0.45mm |
8x10.5x1.2(Max.) | 0.8mm | 0.45mm | |
9x11.5x1.2(Max.) | 0.8mm | 0.45mm | |
84B wBGA | 8x12.5x1.2(Max.) | 0.8mm | 0.45mm |
| Package Type | Package Size | Ball Size | Ball/Lead pitch |
78B wBGA | 7.5x11x1.2(Max.) | 0.45mm | 0.8mm |
8x10.5x1.2(Max.) | 0.45mm | 0.8mm | |
9x10.5x1.2(Max.) | 0.45mm | 0.8mm | |
9x11.1X1.2(Max.) | 0.45mm | 0.8mm | |
9.4x11.1X1.2(Max.) | 0.45mm | 0.8mm | |
10.5x12x1.2(Max.) | 0.45mm | 0.8mm | |
78B FCBGA | 9x10.5x1.2(Max.) | 0.45mm | 0.8mm |
96B wBGA | 9x13x1.2(Max.) | 0.45mm | 0.8mm |
Package Type | Package Size | Ball Size | Ball/Lead pitch |
78B wBGA | 8x12x1.2(Max.) | 0.45mm | 0.8mm |
9x10.5x1.2(Max.) | 0.45mm | 0.8mm | |
78B wBGA | 9x13x1.2(Max.) | 0.45mm | 0.8mm |
9x14x1.2(Max.) | 0.45mm | 0.8mm |
Product Type | Package Type | Package Size | Ball Size | Ball/Lead pitch |
LPDDR2 | 162B FBGA | 12x12x1.1(Max.) | 0.3/0.35mm | 0.5mm |
LPDDR4 | 200B FBGA | 10x14.5x0.85(Max.) | 0.3mm | 0.8x0.65mm |
| Product Type | Package Type | Package Size | Ball Size | Ball/Lead pitch |
eMMC | 153B FBGA | 11.5x13x1.0(Max.) | 0.3mm | 0.5mm |
MCP | 162B FBGA | 11.5x13x1.0(Max.) | 0.3mm | 0.5mm |
9x11.5x1.0(Max.) | 0.3mm | 0.5mm | ||
8x10.5x1.0(Max.) | 0.3mm | 0.5mm | ||
11.5x13x1.0(Max.) | 0.3mm | 0.5mm |
Product Type | Package Type | Package Size | Ball Size | Ball/Lead pitch |
NAND | 48 TSOP | 12x18.4x1.0mm | - | 0.5mm |
63B FBGA | 10.5x13x1.0mm | 0.45mm | 0.8mm | |
132B FBGA | 12x18x1.1mm | 0.45mm | 1.0mm | |
12x18x1.4mm | ||||
13x18x1.1mm | ||||
13x18x1.4mm | ||||
152B FBGA | 14x18x1.0mm | 0.45mm | 1.0mm | |
14x18x1.4mm | ||||
272B FBGA | 14x18x1.4mm | 0.45mm | 0.8mm | |
UDP | 11.3x24.8x1.4mm | - | - | |
Micro SD | 11x15x1.1mm | - | - | |
Nano Memory | 8.8x12.3x0.78mm | - | - | |
SIP - USB | 11.1x16x1.11mm | - | - | |
11.1x18x1.11mm |
| Product Type | Package Type | Package Size | Ball Size | Ball/Lead pitch |
Logic | 130B FBGA | 8x9x1.0/1.05(Max.) | 0.30mm | 0.65mm |
144B FBGA | 10x10x1.2(Max.) | 0.35mm | 0.80mm | |
324B FCCSP | 15x15x2.0(Max.) | 0.45mm | 0.80mm | |
484B FCCSP | 19x19x2.0(Max.) | 0.45mm | 0.80mm |
Test Platform
TITLE
Test Platform
- DRAM
- NAND
- DIMM
- LOGIC
T5831 - 1.2Gbps
UNI-480 
HT3309
V93000
Testing capabilities for RF and mixed-signal ICs
-> PS1600 @ 1600Mbps
-> RF solutions
Advantages
TITLE
Advantages
- High Stacking
- Test Solution
- 2D Marking
With SDBG process, high accuracy die bonder and compression mold,
TJS has full capability to provide the high stacking solutions.
| 8D | 16D | ||
 |
|  |  |
TJS's professional Test R&D Team focus on program development, hardware design and automated integration, etc.
① Program Coding
② Hardware Design -> Burn-In Board | Hifix/DSA | LoadBoard | Socket | Change Kit
③ Automation Integration
Test Platform
Package Roadmap
TITLE
Package Roadmap
- Memory IC
- Function IC
- Bumping
