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     企業郵箱

              
          

          
    
          
        
          
            
            
            
          
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          ABOUT US
          
            
          
        
    
          

                      
          
        
          
    
          

          
    
          
        
          
    
          

          
    
          
        
          
    
          

          Turnkey Solution
          TITLE
          
    
          
        
          
            
          
                
          
                    
          Turnkey Solution
          
                                    
          
            
          
        
          
    
          

          

          
    
          
        
          DRAM 
          DDR2 / DDR3 / DDR4 / DDR5 / LP2 / LP4 / LP5
                       Burn in; Core; Speed; Module
              
          

          

          
    
          
        
          NAND 
          SSD / Micro SD / U-Disk / CF Card / UDP/ eMMC
                       Burn in; Core; Speed; Module
              
          

          

          
    
          
        
          Function IC 
             FCCSP / FCBGA / Hybrid FCCSP + MUF
             Digital; Wireless/RF;  SoC; Power/Analog
              
          

          
    
          
        
          
    
          

          Package Design
          TITLE
          
    
          
        
          
            
          
                
          
                    
          Package Design
          
                                    
          
            
          
        
          
    
          

          

          
    
          
        
          image.png
            AutoCAD 
           ? Lead frame design
           ? Bonding diagram generation
           ? POD Drawing creation etc.
              
          

          

          
    
          
        
          5eee42cb56d96.png 
           Cadence APD 
           ? Substrate routing
              
          

          

          
    
          
        
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           Ansys Icepak 
           ? Junction to ambient thermal resistance
           ? Junction to board thermal resistance 
           ? Junction to case thermal resistance
              
          

          
    
          
        
          
    
          

          Package Design
          TITLE
          
    
          
        
          
            
          
                
          
                    
          Package Design
          
                                    
          
            
          
        
          
    
          

          
    
          
        
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               (Strategic Partnership)
          TJS have a strategic partnering relationship with Jiangsu Nepes.
          We leverages each respective expertise to jointly develop and market technologies for Flipchip turnkey solution.
          --------------------------------------------------------------
          ? 8“ Gold Bump(including COG/COF)
          ? 8“ Solder Bump/WLCSP, Copper Pillar Bump、RDL
          ? 12"CopperPillar Bump 
          ? CP/F & Backend Full Turnkey Service
              
          

          
    
          
        
		
        
    
          

          

          
    
          
        
          
    
          

          

          
    
          
        
          
    
          

          
    
          
        
          
    
          

           
    
          
    
           
         
    
          

          


          










 





 

 

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